On October 28, Reuters reported that ChangXin Memory Technologies, China's largest DRAM manufacturer, plans to start limited production of HBM3E within two months, with a yield of only 20%-30%, far below the approximately 70% level of SK Hynix. Huawei, Cambricon, and others have raised prices by 20%-50% due to rising storage costs.[Chinese Technology][Changxin Storage][chip export controls]